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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11656126 B1

PDFFull Text
Date of Patent:
May. 23, 2023

Filed:

Nov. 15, 2019

Heat treatment apparatus and temperature control method

Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Kazuteru Obara, Oshu, JP;

Koji Yoshii, Oshu, JP;

Yuki Wada, Oshu, JP;

Hitoshi Kikuchi, Oshu, JP;

Assignee:

TOKYO ELECTRON LIMITED, Tokyo, JP;

Attorneys:

Nath, Goldberg & Meyer

Jerald L. Meyer

Tanya E. Harkins

Primary Examiner:

Elizabeth A Burkhart

Int. Cl.
CPC ...
C23C 16/52 (2006.01); G01J 5/00 (2022.01); C23C 16/40 (2006.01); C23C 16/46 (2006.01); C23C 16/458 (2006.01); C23C 16/455 (2006.01); H01L 21/02 (2006.01); H01L 21/687 (2006.01); G05D 23/19 (2006.01); H01L 21/67 (2006.01); G02B 26/12 (2006.01); G01J 5/07 (2022.01);
U.S. Cl.
CPC ...
G01J 5/0007 (2013.01); C23C 16/402 (2013.01); C23C 16/4584 (2013.01); C23C 16/45551 (2013.01); C23C 16/46 (2013.01); C23C 16/52 (2013.01); G01J 5/07 (2022.01); G02B 26/12 (2013.01); G05D 23/1931 (2013.01); H01L 21/0228 (2013.01); H01L 21/02164 (2013.01); H01L 21/67248 (2013.01); H01L 21/68764 (2013.01); H01L 21/68771 (2013.01);
Abstract

There is provided a heat treatment apparatus for performing a predetermined film forming process on a substrate by mounting the substrate on a surface of a rotary table installed in a processing vessel and heating the substrate by a heating part while rotating the rotary table. The heat treatment apparatus includes: a first temperature measuring part of a contact-type configured to measure a temperature of the heating part; a second temperature measuring part of a non-contact type configured to measure a temperature of the substrate mounted on the rotary table in a state where the rotary table is being rotated; and a temperature control part configured to control the heating part based on a first measurement value measured by the first temperature measuring part and a second measurement value measured by the second temperature measuring part.

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