The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 23, 2023
Filed:
May. 04, 2021
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Hsi-Cheng Hsu, Taichung, TW;
Kuo-Hao Lee, Hsinchu, TW;
Jui-Chun Weng, Taipei, TW;
Ching-Hsiang Hu, Taipei, TW;
Ji-Hong Chiang, Changhua, TW;
Lavanya Sanagavarapu, Hsinchu, TW;
Chia-Yu Lin, Taoyuan, TW;
Chia-Chun Hung, Chiayi, TW;
Jia-Syuan Li, Taoyuan, TW;
Yu-Pei Chiang, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
A micro-electromechanical-system (MEMS) device may be formed to include an anti-stiction polysilicon layer on one or more moveable MEMS structures of a device wafer of the MEMS device to reduce, minimize, and/or eliminate stiction between the moveable MEMS structures and other components or structures of the MEMS device. The anti-stiction polysilicon layer may be formed such that a surface roughness of the anti-stiction polysilicon layer is greater than the surface roughness of a bonding polysilicon layer on the surfaces of the device wafer that are to be bonded to a circuitry wafer of the MEMS device. The higher surface roughness of the anti-stiction polysilicon layer may reduce the surface area of the bottom of the moveable MEMS structures, which may reduce the likelihood that the one or more moveable MEMS structures will become stuck to the other components or structures.