The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 16, 2023

Filed:

Oct. 21, 2020
Applicant:

Catlam, Llc, Sunnyvale, CA (US);

Inventors:

Kenneth S. Bahl, Saratoga, CA (US);

Konstantine Karavakis, Pleasanton, CA (US);

Assignee:

CATLAM, LLC, Sunnyvale, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/02 (2006.01); H05K 3/00 (2006.01); H05K 3/06 (2006.01); C08K 3/34 (2006.01); C08K 3/36 (2006.01); H05K 3/42 (2006.01); H05K 3/18 (2006.01); H05K 3/10 (2006.01);
U.S. Cl.
CPC ...
H05K 3/022 (2013.01); C08K 3/34 (2013.01); C08K 3/346 (2013.01); C08K 3/36 (2013.01); H05K 3/0047 (2013.01); H05K 3/061 (2013.01); H05K 3/185 (2013.01); H05K 3/422 (2013.01); H05K 3/426 (2013.01); C08K 2201/005 (2013.01); H05K 3/002 (2013.01); H05K 3/0017 (2013.01); H05K 3/0026 (2013.01); H05K 3/0041 (2013.01); H05K 3/0044 (2013.01); H05K 3/108 (2013.01); H05K 3/427 (2013.01); H05K 2201/0236 (2013.01); H05K 2201/0376 (2013.01); H05K 2203/025 (2013.01); H05K 2203/107 (2013.01);
Abstract

A process for making a circuit board modifies a catalytic laminate having a resin rich surface with catalytic particles dispersed below a surface exclusion depth. The catalytic laminate is subjected to a drilling and resin-rich surface removal operation to expose the catalytic particles, followed by an electroless plating operation which deposits a thin layer of conductive material on the surface. A photo-masking step follows to define circuit traces, after which an electro-plating deposition occurs, followed by a resist strip operation and a quick etch to remove electroless copper which was previously covered by photoresist.


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