The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 16, 2023

Filed:

Dec. 16, 2016
Applicant:

Cree Fayetteville, Inc., Fayetteville, AR (US);

Inventors:

Austin Curbow, Fayetteville, AR (US);

Daniel Martin, Fayetteville, AR (US);

Assignee:

WOLFSPEED, INC., Durham, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H03K 3/013 (2006.01); H03K 5/08 (2006.01); H05K 1/03 (2006.01); H03K 17/082 (2006.01); H01L 25/07 (2006.01); H01L 25/00 (2006.01); H03K 17/16 (2006.01);
U.S. Cl.
CPC ...
H03K 3/013 (2013.01); H01L 25/00 (2013.01); H01L 25/072 (2013.01); H03K 5/08 (2013.01); H03K 17/0822 (2013.01); H03K 17/0826 (2013.01); H03K 17/165 (2013.01); H05K 1/0306 (2013.01); H05K 1/181 (2013.01); H01L 2224/48091 (2013.01); H05K 2201/10166 (2013.01);
Abstract

The disclosure is directed to a power module apparatus that includes a base plate, a power substrate positioned relative to the base plate, at least two power contacts, a gate-source board mounted relative to the power substrate, gate drive connectors electrically connected to the gate-source board, a housing secured to the power substrate, and a clamping circuit electrically connected to the at least one power device. The clamping circuit being configured to clamp an input to a gate of the at least one power device. The clamping circuit being arranged with at least one of the following: the base plate, the power substrate, one of the at least two power contacts, the at least one power device, the gate-source board, the gate drive connectors, and the housing. The disclosure is further directed to a process of configuring a power module apparatus.


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