The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 16, 2023

Filed:

Oct. 02, 2020
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Scott E. Sills, Boise, ID (US);

Yi Fang Lee, Boise, ID (US);

Kevin J. Torek, Meridian, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 27/00 (2006.01); H01L 29/00 (2006.01); H01L 27/12 (2006.01); H01L 29/786 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1225 (2013.01); H01L 27/127 (2013.01); H01L 29/7869 (2013.01); H01L 21/76877 (2013.01); H01L 27/1255 (2013.01);
Abstract

Some embodiments include an integrated assembly which includes a base structure. The base structure includes a series of conductive structures which extend along a first direction. The conductive structures have steps which alternate with recessed regions along the first direction. Pillars of semiconductor material are over the steps. The semiconductor material includes at least one element selected from Group 13 of the periodic table in combination with at least one element selected from Group 16 of the periodic table. The semiconductor material may be semiconductor oxide in some applications. Some embodiments include methods of forming integrated assemblies.


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