The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 16, 2023

Filed:

Dec. 28, 2018
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Wilfred Gomes, Portland, OR (US);

Mark Bohr, Aloha, OR (US);

Rajabali Koduri, Hillsboro, OR (US);

Leonard Neiberg, Portland, OR (US);

Altug Koker, El Dorado Hills, CA (US);

Swaminathan Sivakumar, Beaverton, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 23/538 (2006.01); H01L 21/78 (2006.01); H01L 21/66 (2006.01); H01L 23/528 (2006.01); H01L 23/00 (2006.01); H01L 25/18 (2023.01);
U.S. Cl.
CPC ...
H01L 23/5386 (2013.01); H01L 21/78 (2013.01); H01L 22/20 (2013.01); H01L 23/528 (2013.01); H01L 24/16 (2013.01); H01L 24/24 (2013.01); H01L 24/73 (2013.01); H01L 24/94 (2013.01); H01L 25/18 (2013.01); H01L 23/481 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/73209 (2013.01);
Abstract

A method is disclosed. The method includes a plurality of semiconductor sections and an interconnection structure connecting the plurality of semiconductor sections to provide a functionally monolithic base die. The interconnection structure includes one or more bridge die to connect one or more of the plurality of semiconductor sections to one or more other semiconductor sections or a top layer interconnect structure that connects the plurality of semiconductor sections or both the one or more bridge die and the top layer interconnect structure.


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