The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 16, 2023
Filed:
Jun. 17, 2020
Applicant:
Kioxia Corporation, Tokyo, JP;
Inventors:
Minako Inukai, Yokohama Kanagawa, JP;
Hideaki Sakurai, Kawasaki Kanagawa, JP;
Kyo Otsubo, Shinagawa Tokyo, JP;
Tetsuo Takemoto, Yokohama Kanagawa, JP;
Assignee:
Kioxia Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); B08B 3/04 (2006.01); B08B 7/00 (2006.01); B08B 3/08 (2006.01); B08B 3/12 (2006.01); H01L 21/67 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02101 (2013.01); B08B 3/041 (2013.01); B08B 3/08 (2013.01); B08B 3/123 (2013.01); B08B 7/0014 (2013.01); H01L 21/67051 (2013.01); H01L 21/67248 (2013.01); H01L 22/12 (2013.01); H01L 21/02082 (2013.01);
Abstract
According to one embodiment, a method including supplying a liquid onto a substrate, solidifying the liquid on the substrate to form a solidified body, and melting the solidified body of the liquid on the substrate is provided. When solidifying the liquid, an internal pressure of the liquid on the substrate is varied.