The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 16, 2023

Filed:

Mar. 03, 2021
Applicant:

Bystronic Laser Ag, Niederönz, CH;

Inventors:

Andreas Luedi, Burgdorf, CH;

Roland Bader, Ruetschelen, CH;

Matthias Schranz, Jegenstorf, CH;

Joël Baertschi, Worblaufen, CH;

Assignee:

BYSTRONIC LASER AG, Niederoenz, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 9/00 (2022.01); G06T 7/00 (2017.01); B23K 31/12 (2006.01); B23K 26/03 (2006.01); B23K 26/38 (2014.01);
U.S. Cl.
CPC ...
G06T 7/001 (2013.01); B23K 26/032 (2013.01); B23K 26/38 (2013.01); B23K 31/125 (2013.01); G06T 2207/10016 (2013.01); G06T 2207/10152 (2013.01); G06T 2207/20081 (2013.01); G06T 2207/20084 (2013.01); G06T 2207/30108 (2013.01);
Abstract

A method for process monitoring of a laser machining process for estimating a machining quality is dicloses. The method may include steps, which are carried out in real time during the machining process of providing at least one captured first signal sequence with a first feature form a machining zone, providing at least one captured second signal sequence with a second feature from the machining zone, and accessing a trained neural network with at least the recorded first and second signal sequences in order to calculate a result for estimating the machining quality.


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