The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 16, 2023

Filed:

Jun. 28, 2019
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Gavin Sung, Taichung, TW;

Gerry Juan, Taipei, TW;

Harish Jagadish, Bangalore, IN;

Ivan By Wang, Taipei, TW;

Jason Y. Jiang, Taipei, TW;

Sammi Wy Liu, New Taipei, TW;

Tim Liu, New Taipei, TW;

Jeff Ku, Taipei, TW;

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F25B 21/02 (2006.01); F25B 9/00 (2006.01); F25B 25/00 (2006.01);
U.S. Cl.
CPC ...
F25B 21/02 (2013.01); F25B 9/006 (2013.01); F25B 25/00 (2013.01);
Abstract

Particular embodiments described herein provide for an electronic device that can be configured to include a hybrid thermal management system. The hybrid thermal management system can include a heat source, an air mover, a heat sink coupled to the air mover, a thermal electric cooling device (TEC), and a heat pipe. The heat pipe can couple the heat source to the heat sink and to the TEC and transfer heat from the heat source to the heat sink and to the TEC.


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