The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 16, 2023

Filed:

Mar. 06, 2017
Applicant:

Hitachi Chemical Company, Ltd., Tokyo, JP;

Inventors:

Kazuya Baba, Tokyo, JP;

Teruyuki Nagayoshi, Tokyo, JP;

Yuichi Fukuzawa, Tokyo, JP;

Assignee:

RESONAC CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F16D 69/02 (2006.01); F16D 65/04 (2006.01);
U.S. Cl.
CPC ...
F16D 69/026 (2013.01); F16D 65/04 (2013.01); F16D 2200/0039 (2013.01); F16D 2200/0065 (2013.01);
Abstract

There are provided a friction material composition containing no copper or having a reduced content of copper that can provide a friction material in which the stability of the friction coefficient after standing in a cold environment, the abrasion resistance, and the low rust fixation properties are excellent, and squeal (particularly low temperature squeal) is suppressed, and a friction material obtained by molding the friction material composition, and a friction member using the friction material. The friction material composition is specifically a friction material composition comprising a bonding material, an organic filler, an inorganic filler, and a fiber substrate, in which the friction material composition comprises no copper, or has a content of copper of less than 0.5% by mass in terms of a copper element even if comprising the copper, and comprises, as the organic filler, cashew particles to which a silicone resin adheres.


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