The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 16, 2023

Filed:

Feb. 13, 2017
Applicant:

Fujimi Incorporated, Kiyosu, JP;

Inventor:

Makoto Tabata, Kiyosu, JP;

Assignee:

FUJIMI INCORPORATED, Kiyosu, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/11 (2012.01); B24B 37/00 (2012.01); H01L 21/02 (2006.01); C09G 1/02 (2006.01); H01L 21/304 (2006.01); B24B 37/08 (2012.01);
U.S. Cl.
CPC ...
B24B 37/11 (2013.01); B24B 37/00 (2013.01); B24B 37/08 (2013.01); C09G 1/02 (2013.01); H01L 21/02013 (2013.01); H01L 21/02024 (2013.01); H01L 21/304 (2013.01);
Abstract

Provided are a method for polishing a silicon substrate according to which PID can be reduced and a polishing composition set usable in the polishing method. The silicon substrate polishing method provided by this invention comprises a stock polishing step and a final polishing step. The stock polishing step comprises several stock polishing sub-steps carried out on one same platen. The several stock polishing sub-steps comprise a final stock polishing sub-step carried out while supplying a final stock polishing slurry Pto the silicon substrate. The total amount of the final stock polishing slurry Psupplied to the silicon substrate during the final stock polishing sub-step has a total weight of Cu and a total weight of Ni, at least one of which being 1 μg or less.


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