The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 09, 2023

Filed:

Jul. 13, 2020
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Jivaan Kishore Jhothiraman, Meridian, ID (US);

John Mark Meldrim, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/1157 (2017.01); H01L 27/11565 (2017.01); H01L 27/11582 (2017.01);
U.S. Cl.
CPC ...
H01L 27/1157 (2013.01); H01L 27/11565 (2013.01); H01L 27/11582 (2013.01);
Abstract

A method used in forming integrated circuitry comprises forming a stack comprising vertically-alternating first tiers and second tiers. The stack comprises a cavity therein that comprises a stair-step structure. Sidewalls of the cavity and steps of the stair-step structure are lined with an insulator material. Insulative material is formed in the cavity radially inward of the insulator material. An upper portion of the insulative material is removed from the cavity to leave the insulative material in a bottom of the cavity over the stair-step structure. After the removing, insulating material is formed in the cavity above the insulative material. Other embodiments, including structure independent of method, are disclosed.


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