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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11647589 B1

PDFFull Text
Date of Patent:
May. 09, 2023

Filed:

Jul. 20, 2021

Wiring board

Applicant:

Shinko Electric Industries Co., Ltd., Nagano, JP;

Inventor:

Shuhei Momose, Nagano, JP;

Assignee:

SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano, JP;

Attorney:

IPUSA, PLLC

Primary Examiner:

Timothy J Thompson

Assistant Examiner:

John B Freal

Int. Cl.
CPC ...
H05K 1/16 (2006.01); H01L 23/498 (2006.01); H01L 23/58 (2006.01); H05K 1/11 (2006.01); H01L 21/48 (2006.01); H05K 3/42 (2006.01); H05K 3/06 (2006.01);
U.S. Cl.
CPC ...
H05K 1/165 (2013.01); H01L 21/486 (2013.01); H01L 23/49827 (2013.01); H01L 23/58 (2013.01); H05K 1/115 (2013.01); H05K 3/06 (2013.01); H05K 3/426 (2013.01); H05K 2201/0347 (2013.01); H05K 2201/0959 (2013.01); H05K 2203/072 (2013.01); H05K 2203/0723 (2013.01);
Abstract

A wiring board includes an insulating base including a first principal surface, a second principal surface opposite to the first principal surface, and a first through hole penetrating the insulating base from the first principal surface to the second principal surface, a functional material provided inside the first through hole, a first insulating layer covering the first principal surface, and a first surface of the functional material, and a second insulating layer covering the second principal surface, and a second surface of functional material. A second through hole is formed in the first insulating layer, the functional material, and the second insulating layer, and a conductive layer is formed on a wall surface of the second through hole.

Find Patent Forward Citations

Momose, Shuhei. (2023). Wiring board (U.S. Patent No. 11647589). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11647589

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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