The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 09, 2023

Filed:

Jun. 16, 2021
Applicant:

Threebond Co., Ltd., Tokyo, JP;

Inventor:

Nao Suzuki, Tokyo, JP;

Assignee:

THREEBOND CO., LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 8/0284 (2016.01); C08L 23/26 (2006.01); C09K 3/10 (2006.01); H01M 8/0273 (2016.01); H01M 8/0286 (2016.01); H01M 8/1004 (2016.01); H01M 8/1018 (2016.01); H01M 8/10 (2016.01);
U.S. Cl.
CPC ...
H01M 8/0284 (2013.01); C08L 23/26 (2013.01); C09K 3/10 (2013.01); H01M 8/0273 (2013.01); H01M 8/0286 (2013.01); H01M 8/1004 (2013.01); H01M 8/1018 (2013.01); C08L 2203/206 (2013.01); C09K 2003/1062 (2013.01); C09K 2200/0617 (2013.01); H01M 2008/1095 (2013.01); H01M 2300/0082 (2013.01);
Abstract

An object of the present invention is to provide a photocurable resin composition having a high curing degree after irradiation with light while maintaining cured material characteristics such as high extensibility and high strength. Provided is a photocurable resin composition including the following ingredients (A) to (C):


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