The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 09, 2023

Filed:

Sep. 19, 2020
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Alexander Reznicek, Troy, NY (US);

Karthik Balakrishnan, Scarsdale, NY (US);

Bahman Hekmatshoartabari, White Plains, NY (US);

Clint Jason Oteri, East Greenbush, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 29/161 (2006.01); H01L 29/66 (2006.01); H01L 27/108 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7827 (2013.01); H01L 27/10802 (2013.01); H01L 27/10805 (2013.01); H01L 29/161 (2013.01); H01L 29/66666 (2013.01);
Abstract

A Vertical Field Effect Transistor (VFET) and/or a one transistor dynamic random access memory 1T DRAM that has a substrate with a horizontal substrate surface, a source disposed on the horizontal substrate surface, a drain, and a channel. The channel has a channel top, a channel bottom, a first channel side, a second channel side, and two channel ends. The channel top is connected to the drain. The channel bottom is connected to the source. The channel is vertical and perpendicular to the substrate surface. A first gate stack interfaces with the first channel side and a second gate stack interfaces with the second channel side. A single external gate connection electrically connects the first gate stack and the second gate stack A gate bias (voltage) applied on the single external gate connection biases the first channel side in accumulation and biases the second channel side in inversion. The first gate stack is made of a first high-k dielectric layer and a first gate metal layer. The second gate stack is made of a second high-k dielectric layer and a second gate metal layer. The single external gate electrical connection is made to the first gate metal layer and the second gate metal layer. The first and second channel side can be made of the same or different materials. The first and second gate metal layer can be made of the same or different materials. One of the channel ends forms a floating body region, i.e. a capacitance, used by the 1T DRAM.


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