The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 09, 2023
Filed:
Apr. 02, 2018
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventor:
Tyler Leuten, Orangevale, CA (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/00 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49816 (2013.01); H01L 24/48 (2013.01); H05K 1/111 (2013.01); H01L 2924/01079 (2013.01);
Abstract
Embodiments include a microelectronic package structure having a substrate with one or more substrate pads on a first side of the package substrate. A ball interconnect structure is on the substrate pad, the ball interconnect structure comprising at least 99.0 percent gold. A discrete component having two or more component terminals is on the ball interconnect structure.