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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11646229 B1

PDFFull Text
Date of Patent:
May. 09, 2023

Filed:

Feb. 10, 2021

Processing method of device wafer

Applicant:

Disco Corporation, Tokyo, JP;

Inventor:

Minoru Suzuki, Tokyo, JP;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:

Greer Burns & Crain Ltd.

Primary Examiner:

Ali Naraghi

Assistant Examiner:

Siangluai Mang

Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 21/02 (2006.01); H01L 21/268 (2006.01); H01L 21/683 (2006.01); H01L 23/544 (2006.01); H01L 21/3065 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); H01L 21/02079 (2013.01); H01L 21/268 (2013.01); H01L 21/3065 (2013.01); H01L 21/6836 (2013.01); H01L 23/544 (2013.01); H01L 2221/68336 (2013.01); H01L 2223/5446 (2013.01);
Abstract

A processing method of a device wafer includes a mask coating step of coating a front surface of the device wafer with a water-soluble resin, a mask forming step of applying a laser beam along each division line, forming a groove, and removing a protective mask and a functional layer to expose a substrate, a plasma etching step of forming a division groove that divides the substrate along the groove by supplying a gas in a plasma condition, an expanding step of expanding a protective tape in a plane direction to expand a width of the division groove, an adhesive film dividing step of applying a laser beam along the division groove to divide the adhesive film that has been exposed due to the formation of the division groove, and a cleaning step of cleaning and removing the water-soluble resin.

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Suzuki, Minoru. (2023). Processing method of device wafer (U.S. Patent No. 11646229). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11646229

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