The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 09, 2023

Filed:

Dec. 29, 2020
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Daniel Redfield, Morgan Hill, CA (US);

Jason Garcheung Fung, Santa Clara, CA (US);

Mayu Felicia Yamamura, San Carlos, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24D 11/00 (2006.01); B29C 64/112 (2017.01); B29C 64/393 (2017.01); B33Y 30/00 (2015.01); B33Y 80/00 (2015.01); B33Y 50/02 (2015.01); B33Y 10/00 (2015.01); B29C 64/282 (2017.01); B29C 64/40 (2017.01); C09G 1/16 (2006.01); B24B 37/20 (2012.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
B24D 11/006 (2013.01); B29C 64/112 (2017.08); B29C 64/282 (2017.08); B29C 64/393 (2017.08); B29C 64/40 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 50/02 (2014.12); B33Y 80/00 (2014.12); C09G 1/16 (2013.01); B24B 37/20 (2013.01); B29L 2031/736 (2013.01);
Abstract

A method of fabricating a polishing pad using an additive manufacturing system includes depositing a first set successive layers by droplet ejection to form a. Depositing the successive layers includes dispensing a polishing pad precursor to first regions corresponding to partitions of the polishing pad and dispensing a sacrificial material to second regions corresponding to grooves of the polishing pad. Removing the sacrificial material provides the polishing pad with a polishing surface that has the partitions separated by the grooves.


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