The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 02, 2023

Filed:

Jan. 10, 2022
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Sanjay Subbarao, Irvine, CA (US);

Johnny A. Lam, Firestone, CO (US);

John E. Maroney, Irvine, CA (US);

Mark Ish, San Ramon, CA (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 12/02 (2006.01); G06F 12/0873 (2016.01); G06F 9/355 (2018.01); G06F 12/0882 (2016.01);
U.S. Cl.
CPC ...
G06F 12/0246 (2013.01); G06F 9/355 (2013.01); G06F 12/0873 (2013.01); G06F 12/0882 (2013.01); G06F 2212/7201 (2013.01);
Abstract

A system includes integrated circuit (IC) dies having memory cells and a processing device, which is to perform operations including generating a number of zone map entries for zones of a logical block address (LBA) space that are sequentially mapped to physical address space of the plurality of IC dies, wherein each zone map entry corresponds to a respective data group that has been sequentially written to one or more IC dies; and generating a die identifier and a block identifier for each data block of multiple data blocks of the respective data group, wherein each data block corresponds to a media block of the plurality of IC dies.


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