The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 02, 2023

Filed:

Aug. 08, 2022
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Ting Luo, Santa Clara, CA (US);

Tao Liu, San Jose, CA (US);

Christopher J. Bueb, Folsom, CA (US);

Eric Yuen, Dublin, CA (US);

Cheng Cheng Ang, Singapore, SG;

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 11/00 (2006.01); G06F 11/30 (2006.01); G06F 11/07 (2006.01); G11C 7/04 (2006.01); G11C 11/406 (2006.01); G11C 7/10 (2006.01);
U.S. Cl.
CPC ...
G06F 11/3058 (2013.01); G06F 11/076 (2013.01); G06F 11/0772 (2013.01); G06F 11/3037 (2013.01); G11C 7/04 (2013.01); G11C 7/1069 (2013.01); G11C 7/1096 (2013.01); G11C 11/40626 (2013.01); G06F 2201/81 (2013.01);
Abstract

A method includes monitoring a temperature of a memory component of a memory sub-system to determine that the temperature of the memory component corresponds to a first monitored temperature value; writing data to the memory component of the memory sub-system while the temperature of the memory component corresponds to the first monitored temperature value; determining that the first monitored temperature value exceeds a threshold temperature range; monitoring the temperature of the memory component of the memory sub-system to determine that the temperature of the memory component corresponds to a second monitored temperature value that is within the threshold temperature range; and rewriting the data to the memory component of the memory sub-system while the temperature of the memory component corresponds to the second monitored temperature value.


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