The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 02, 2023
Filed:
Jun. 09, 2020
Applicant:
Applied Materials, Inc, Santa Clara, CA (US);
Inventors:
Uma Sridhar, Sunnyvale, CA (US);
Sivapackia Ganapathiappan, Los Altos, CA (US);
Ashwin Murugappan Chockalingam, San Jose, CA (US);
Rajeev Bajaj, Fremont, CA (US);
Daniel Redfield, Morgan Hill, CA (US);
Mayu Felicia Yamamura, San Carlos, CA (US);
Yingdong Luo, Newark, CA (US);
Nag B. Patibandla, Pleasanton, CA (US);
Assignee:
Applied Materials, Inc., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/24 (2012.01); C09D 11/102 (2014.01); C09D 11/101 (2014.01); B33Y 80/00 (2015.01); B29C 64/112 (2017.01); B33Y 10/00 (2015.01); B33Y 70/00 (2020.01); H01L 21/306 (2006.01); B29K 63/00 (2006.01); B29K 75/00 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
B24B 37/24 (2013.01); B29C 64/112 (2017.08); B33Y 10/00 (2014.12); B33Y 70/00 (2014.12); B33Y 80/00 (2014.12); C09D 11/101 (2013.01); C09D 11/102 (2013.01); B29K 2063/00 (2013.01); B29K 2075/00 (2013.01); B29K 2995/0046 (2013.01); B29K 2995/0089 (2013.01); B29L 2031/736 (2013.01); H01L 21/30625 (2013.01);
Abstract
A polishing pad for a semiconductor fabrication operation includes a polishing region and a window region, wherein both regions are made of an interpenetrating polymer network formed from a free-radically polymerized material and a cationically polymerized material.