The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 25, 2023
Filed:
Jul. 24, 2020
Applicant:
Catlam Llc, Sunnyvale, CA (US);
Inventors:
Kenneth S. Bahl, Saratoga, CA (US);
Konstantine Karavakis, Pleasanton, CA (US);
Assignee:
CATLAM, LLC, Sunnyvale, CA (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/42 (2006.01); H05K 3/00 (2006.01); H05K 3/06 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 3/429 (2013.01); H05K 3/007 (2013.01); H05K 3/0035 (2013.01); H05K 3/0038 (2013.01); H05K 3/06 (2013.01); H05K 3/064 (2013.01); H05K 3/421 (2013.01); H05K 3/422 (2013.01); H05K 3/423 (2013.01); H05K 3/4652 (2013.01); H05K 3/425 (2013.01); H05K 2203/0152 (2013.01); H05K 2203/0723 (2013.01); H05K 2203/107 (2013.01); H05K 2203/1407 (2013.01);
Abstract
A method for forming a circuit board having a dielectric core, a foil top surface, and a thin foil bottom surface with a removable foil backing of sufficient thickness to absorb heat from a laser drilling operation to prevent the penetration of the thin foil bottom surface during laser drilling utilizes a sequence of steps including a laser drilling step, removing the foil backing step, electroless plating step, patterned resist step, electroplating step, resist strip step, tin plate step, and copper etch step, which provide dot vias of fine linewidth and resolution.