The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 25, 2023
Filed:
May. 18, 2018
Applicant:
Namics Corporation, Niigata, JP;
Inventors:
Fuminori Arai, Niigata, JP;
Kazuki Iwaya, Niigata, JP;
Assignee:
NAMICS CORPORATION, Niigata, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 129/12 (2006.01); C08K 3/013 (2018.01); C08J 5/18 (2006.01); C08K 5/00 (2006.01); C08K 5/17 (2006.01); H01L 23/10 (2006.01); C08J 5/24 (2006.01);
U.S. Cl.
CPC ...
C09J 129/12 (2013.01); C08J 5/18 (2013.01); C08J 5/249 (2021.05); C08K 3/013 (2018.01); C08K 5/005 (2013.01); C08K 5/17 (2013.01); H01L 23/10 (2013.01); C08J 2329/12 (2013.01);
Abstract
A resin composition contains one or more 2-methylene-1,3-dicarbonyl compounds. At least one of the one or more 2-methylene-1,3-dicarbonyl compounds has a molecular weight of 220 to 10,000, and the amount by weight of those of the 2-methylene-1,3-dicarbonyl compounds having a molecular weight of less than 220 relative the entire resin composition of 1 is 0.00 to 0.05. The 2-methylene-1,3-dicarbonyl compounds contain a structural unit represented by formula (I) below.