The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 25, 2023
Filed:
Mar. 22, 2019
Applicant:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Inventors:
Toru Hayashida, Tokyo, JP;
Shunsaku Yoshikawa, Tokyo, JP;
Takashi Saito, Tokyo, JP;
Kanta Dei, Tokyo, JP;
Assignee:
SENJU METAL INDUSTRY CO., LTD., Tokyo, JP;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/02 (2006.01); B23K 35/26 (2006.01); B23K 35/362 (2006.01); B23K 103/08 (2006.01);
U.S. Cl.
CPC ...
B23K 35/025 (2013.01); B23K 35/264 (2013.01); B23K 35/362 (2013.01); B23K 2103/08 (2018.08);
Abstract
Provided is a solder paste which uses a conventional flux, and for which long-term preservation is made possible and an easy preservation method can be realized by suppressing changes in the viscosity of the paste over time. This solder paste is provided with a solder powder, a zirconium oxide powder, and a flux, and changes in the viscosity of the paste over time are suppressed.