The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 11, 2023

Filed:

May. 26, 2021
Applicants:

Avary Holding (Shenzhen) Co., Limited., Shenzhen, CN;

Hongqisheng Precision Electronics (Qinhuangdao) Co., Ltd., Qinhuangdao, CN;

Garuda Technology Co., Ltd., New Taipei, TW;

Inventors:

Yong-Chao Wei, Qinhuangdao, CN;

Po-Yuan Chen, New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/46 (2006.01); H05K 1/02 (2006.01); H05K 3/34 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4688 (2013.01); H05K 1/0298 (2013.01); H05K 1/111 (2013.01); H05K 3/34 (2013.01); H05K 3/4644 (2013.01); H05K 2201/09372 (2013.01);
Abstract

A circuit board includes a circuit substrate, a solder, and a surrounding portion. The circuit substrate includes a connecting pad. The solder is formed on a surface of the connecting pad. The surrounding portion is formed on the surface of the connecting pad and cooperates with the connecting pad to form a groove receiving the solder. The surrounding portion surrounds the solder and is spaced from the solder. A method for manufacturing a circuit board is also provided.


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