The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 11, 2023

Filed:

May. 19, 2020
Applicant:

Amkor Technology Singapore Holding Pte. Ltd., Singapore, SG;

Inventor:

Cheol Ho Lee, Incheon, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 21/78 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/31 (2013.01); H01L 21/78 (2013.01); H01L 24/94 (2013.01); H01L 25/0655 (2013.01);
Abstract

In one example, a semiconductor device comprises a main substrate comprising a first side and a main conductive structure, and a first component module over the first side of the main substrate. The first component module comprises a first electronic component and a first module encapsulant contacting a lateral side of the first electronic component. The semiconductor device further comprises a second component module over the first side of the main substrate. The second component module comprises a second electronic component and a second module encapsulant contacting a lateral side of the second electronic component. The semiconductor device further comprises a main encapsulant over a first side of the main substrate and between the first component module and the second component module. Other examples and related methods are also disclosed herein.


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