The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 11, 2023
Filed:
Nov. 17, 2020
Applicant:
Asm Ip Holding B.v., Almere, NL;
Inventors:
Mitsuya Utsuno, Tachikawa, JP;
Yan Zhang, Tama, JP;
Yoshio Susa, Tokyo, JP;
Atsuki Fukazawa, Tama, JP;
Assignee:
ASM IP Holding B.V., Versterkerstraat, NL;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/762 (2006.01); H01L 21/02 (2006.01); H01L 21/311 (2006.01); C23C 16/26 (2006.01); C23C 16/455 (2006.01); C23C 16/50 (2006.01); C23C 16/04 (2006.01); C23C 16/56 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76224 (2013.01); C23C 16/045 (2013.01); C23C 16/26 (2013.01); C23C 16/45536 (2013.01); C23C 16/50 (2013.01); C23C 16/56 (2013.01); H01L 21/022 (2013.01); H01L 21/31122 (2013.01); H01L 21/0228 (2013.01); H01L 21/02115 (2013.01); H01L 21/02118 (2013.01); H01L 21/02205 (2013.01); H01L 21/02274 (2013.01);
Abstract
Methods and systems for filling a recess on a surface of a substrate with carbon-containing material are disclosed. Exemplary methods include forming a first carbon layer within the recess, etching a portion of the first carbon layer within the recess, and forming a second carbon layer within the recess. Structures formed using the method or system are also disclosed.