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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11626302 B1

PDFFull Text
Date of Patent:
Apr. 11, 2023

Filed:

Jul. 19, 2022

Bonding method for cleaning non-bonding surface of substrate

Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Yuji Mimura, Koshi, JP;

Hiroshi Maeda, Koshi, JP;

Satoshi Nishimura, Koshi, JP;

Assignee:

TOKYO ELECTRON LIMITED, Tokyo, JP;

Attorney:

Pearne & Gordon LLP

Primary Examiner:

Joseph L Williams

Int. Cl.
CPC ...
H01J 9/48 (2006.01); H01L 21/67 (2006.01); H01J 37/36 (2006.01); H01L 21/304 (2006.01); H01L 21/66 (2006.01); G06T 7/00 (2017.01); H01L 21/18 (2006.01); H01J 37/32 (2006.01); B32B 37/00 (2006.01); B24B 7/00 (2006.01); B24D 3/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67092 (2013.01); B24B 7/00 (2013.01); B24D 3/00 (2013.01); B32B 37/00 (2013.01); G06T 7/0008 (2013.01); H01J 9/48 (2013.01); H01J 37/32 (2013.01); H01J 37/32009 (2013.01); H01J 37/32798 (2013.01); H01J 37/36 (2013.01); H01L 21/187 (2013.01); H01L 21/304 (2013.01); H01L 21/67288 (2013.01); H01L 22/12 (2013.01); G06T 2207/30148 (2013.01);
Abstract

A bonding system includes a surface modifying apparatus configured to modify a bonding surface of a first substrate and a bonding surface of a second substrate; a surface hydrophilizing apparatus configured to hydrophilize the modified bonding surface of the first substrate and the modified bonding surface of the second substrate; a bonding apparatus configured to perform bonding of the hydrophilized bonding surface of the first substrate and the hydrophilized bonding surface of the second substrate in a state that the bonding surfaces face each other; and a cleaning apparatus configured to clean, before the bonding is performed, a non-bonding surface of, between the first substrate and the second substrate, at least one which is maintained flat when the bonding is performed, the not-bonding surface being opposite to the bonding surface.

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