The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 04, 2023

Filed:

May. 12, 2020
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventor:

Shinsuke Oka, Miyagi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01J 37/32 (2006.01); G05D 23/19 (2006.01); H01L 21/683 (2006.01); H01L 21/3065 (2006.01); H05B 1/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67103 (2013.01); G05D 23/19 (2013.01); G05D 23/193 (2013.01); H01J 37/32532 (2013.01); H01J 37/32724 (2013.01); H01J 37/32926 (2013.01); H01J 37/32935 (2013.01); H01L 21/3065 (2013.01); H01L 21/67248 (2013.01); H01L 21/683 (2013.01); H05B 1/0233 (2013.01);
Abstract

A plasma processing apparatus includes a measurement unit that, while controlling a supply power to a heater such that a temperature of the heater becomes constant, measures the supply power to the heater in a non-ignition state where a plasma is not ignited and in a transient state where the supply power to the heater is reduced after the plasma is ignited. The plasma processing apparatus also includes a parameter calculator that calculates a thickness of a top plate by performing a fitting on a calculation model which includes the thickness of the top plate as a parameter and calculates the supply power in the transient state, using the measured supply power in the non-ignition state and the transition state.


Find Patent Forward Citations

Loading…