The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 04, 2023

Filed:

Apr. 20, 2021
Applicant:

Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;

Inventor:

Cheng-Hao Huang, Hsinchu, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/16 (2006.01); G09F 9/30 (2006.01); H01L 21/822 (2006.01); H01L 51/56 (2006.01); H01L 51/52 (2006.01); H01L 51/00 (2006.01); G02F 1/1345 (2006.01); H01L 27/32 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
G06F 1/1652 (2013.01); G09F 9/301 (2013.01); H01L 21/822 (2013.01); H01L 51/0097 (2013.01); H01L 51/5237 (2013.01); H01L 51/56 (2013.01); G02F 1/13458 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 27/3276 (2013.01);
Abstract

A method of manufacturing a flexible display includes providing a substrate having a first and second pad density areas and a pair of long sides; forming conductive pads on the substrate, each of the conductive pad is free of right angle and in a shape of parallelogram, and a pad density of the second pad density area is higher than that of the first pad density area; providing a flexible substrate; and bonding the conductive pads to a conductor of a circuit of the flexible substrate. Each of the conductive pad has long sides and short sides, a portion of the conductive pads have the long sides sloped away from the first pad density area and toward one long side of the substrate, and the rest of the conductive pads have the long sides sloped away the first pad density area and toward the other long side of the substrate.


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Huang, Cheng-Hao. (2023). Method of manufacturing a semiconductor device for attaching to a flexible display (U.S. Patent No. 11619974). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11619974

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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