The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 04, 2023

Filed:

Dec. 09, 2020
Applicant:

Disco Corporation, Tokyo, JP;

Inventors:

Kenji Takenouchi, Tokyo, JP;

Hiroyuki Kashiwagi, Tokyo, JP;

Jun Suwano, Tokyo, JP;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C02F 1/66 (2023.01); C02F 1/68 (2023.01); C02F 1/32 (2023.01); C02F 1/42 (2023.01); B01D 21/00 (2006.01); C02F 103/34 (2006.01); C02F 1/00 (2023.01);
U.S. Cl.
CPC ...
C02F 1/66 (2013.01); B01D 21/0045 (2013.01); C02F 1/32 (2013.01); C02F 1/42 (2013.01); C02F 1/68 (2013.01); C02F 2001/007 (2013.01); C02F 2103/346 (2013.01); C02F 2209/06 (2013.01);
Abstract

A waste fluid treatment apparatus includes a sedimentation tank that stores the processing waste fluid with the processing debris contained therein, an inflow port provided on the sedimentation tank for introduction of the processing waste fluid into the sedimentation tank, an acidification unit configured to acidify the processing waste fluid to be introduced from the inflow port into the sedimentation tank, whereby the processing debris is allowed to settle at a higher rate compared with a rate at which the processing debris would settle if the processing waste water is neutral, and an outflow port provided on the sedimentation tank for discharge of acidic supernatant that is obtained by allowing the processing debris in the processing waste fluid to settle in the sedimentation tank from the sedimentation tank.


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