The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11616007 B1

Date of Patent:

Mar. 28, 2023

Filed:

Oct. 08, 2020

Electronic package

Applicant:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Inventors:

You-Lung Yen, Kaohsiung, TW;

Bernd Karl Appelt, Kaohsiung, TW;

Kay Stephan Essig, Kaohsiung, TW;

Assignee:

ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;

Attorney:

Foley & Lardner LLP

Primary Examiner:

Nicholas J Tobergte

Int. Cl.

CPC ...

H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01);

U.S. Cl.

CPC ...

H01L 23/49822 (2013.01); H01L 21/4857 (2013.01); H01L 21/56 (2013.01); H01L 23/3107 (2013.01); H01L 23/49816 (2013.01);

Abstract

An electronic package and method for manufacturing the same are provided. The electronic package includes a substrate and a wetting layer. The substrate includes a plurality of conductive step structures each including a first portion and a second portion. The first portion has a first bottom surface, a first outer surface and a first inner surface. The second portion has a second bottom surface, a second outer surface and a second inner surface, wherein the second portion partially exposes the first bottom surface. The wetting layer at least covers the second bottom surface, the second outer surface and the second inner surface of the second portion of each of the conductive step structures.

Find Patent Forward Citations