The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 28, 2023

Filed:

Apr. 16, 2021
Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Hiroshi Sotozaki, Tokyo, JP;

Tadakazu Sone, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 57/02 (2006.01); B24B 55/12 (2006.01); B24B 55/02 (2006.01); B24B 37/015 (2012.01); B24B 49/14 (2006.01); B24B 37/04 (2012.01); B24B 55/06 (2006.01); B24B 37/10 (2012.01);
U.S. Cl.
CPC ...
B24B 57/02 (2013.01); B24B 37/015 (2013.01); B24B 37/042 (2013.01); B24B 37/107 (2013.01); B24B 49/14 (2013.01); B24B 55/02 (2013.01); B24B 55/06 (2013.01); B24B 55/12 (2013.01);
Abstract

Provided is a polishing apparatus and polishing method which can preferably adjust a temperature of a surface of a polishing pad. A polishing apparatus includes: a polishing table configured to be rotatable, and to support the polishing pad; a substrate configured to hold an object to be polished, and to press the object to be polished against the polishing pad; a polishing liquid supplying portion configured to supply a polishing liquid to a polishing surface; a polishing liquid removing portion configured to remove the polishing liquid from the polishing surface; and a temperature adjuster configured to adjust a temperature of the polishing surface. In a rotating direction of the polishing table, the polishing liquid supplying portion, a polishing region where the object to be polished is pressed against the polishing surface by the substrate, the polishing liquid removing portion, and the temperature adjuster are disposed in this order.


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