The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 21, 2023

Filed:

Apr. 08, 2021
Applicant:

Winbond Electronics Corp., Taichung, TW;

Inventors:

Keng-Ping Lin, Taichung, TW;

Tetsuharu Kurokawa, Taichung, TW;

Tzu-Ming Ou Yang, Taichung, TW;

Shu-Ming Li, Taichung, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/108 (2006.01); H01L 29/06 (2006.01); H01L 21/761 (2006.01); H01L 21/033 (2006.01); H01L 21/027 (2006.01); H01L 21/02 (2006.01); H01L 21/768 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
H01L 27/10894 (2013.01); H01L 21/0254 (2013.01); H01L 21/0274 (2013.01); H01L 21/02527 (2013.01); H01L 21/0337 (2013.01); H01L 21/31144 (2013.01); H01L 21/761 (2013.01); H01L 21/76802 (2013.01); H01L 21/76877 (2013.01); H01L 27/10897 (2013.01); H01L 29/0623 (2013.01);
Abstract

Provided is a landing pad structure including a substrate, a plurality of landing pads, a guard ring, and an edge pattern. The substrate includes a cell region, a periphery region, and a guard ring region located between the cell region and the periphery region. The landing pads are arranged on the substrate in the cell region in a hexagonal close packing (HCP) configuration. The guard ring is disposed on the substrate in the guard ring region in a strip form. The edge pattern is disposed on the substrate in the cell region and close to the guard ring region. A method of manufacturing the landing pad structure is also provided.


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