The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 21, 2023
Filed:
May. 14, 2020
Applicant:
Semiconductor Components Industries, Llc, Phoenix, AZ (US);
Inventors:
Assignee:
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 23/373 (2006.01); H01L 23/40 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); H01L 23/3735 (2013.01); H01L 23/4006 (2013.01); H01L 2023/405 (2013.01); H01L 2023/4031 (2013.01); H01L 2023/4056 (2013.01); H01L 2023/4087 (2013.01);
Abstract
In one general aspect, an apparatus can include a module including a semiconductor die. The apparatus can include a heatsink coupled to the module and including a substrate, and a plurality of protrusions. The apparatus includes a cover defining a channel where the channel is outside of the module and the plurality of protrusions of the heatsink are disposed within the channel, and a sealing mechanism is disposed between the cover and the module is in contact with the module.