The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 21, 2023

Filed:

Feb. 14, 2019
Applicant:

Sekisui Polymatech Co., Ltd., Saitama, JP;

Inventor:

Shigeru Koyano, Higashimurayama, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/36 (2006.01); B32B 7/027 (2019.01); H01L 23/42 (2006.01); H01L 23/373 (2006.01); H05K 7/20 (2006.01); B32B 27/08 (2006.01); B32B 27/20 (2006.01);
U.S. Cl.
CPC ...
H01L 23/36 (2013.01); B32B 7/027 (2019.01); B32B 27/08 (2013.01); B32B 27/20 (2013.01); H01L 23/3737 (2013.01); H01L 23/42 (2013.01); H05K 7/20481 (2013.01);
Abstract

A heat-conducting sheet comprising a first heat-conducting layer, a second heat-conducting layer, an interface, a polymer matrix, an anisotropic filler and a non-anisotropic filler, wherein: the first and second heat-conducting layers each comprise the polymer matrix, the anisotropic filler and the non-anisotropic filler, the anisotropic filler oriented in a thickness direction, the first and second heat-conducting layers are laminated via the interface, the interface comprises the polymer matrix and the non-anisotropic filler, a filling ratio of the anisotropic filler in the interface is lower than that in the first and second heat-conducting layers, and a filling ratio of the non-anisotropic filler in the interface is higher than that in the first and second heat-conducting layers; and a method of producing the heat-conducting sheet.


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