The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 21, 2023
Filed:
Jun. 12, 2020
Applicant:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Inventors:
Shunsaku Yoshikawa, Tokyo, JP;
Takashi Saito, Tokyo, JP;
Takahiro Matsufuji, Tokyo, JP;
Naoko Izumita, Tokyo, JP;
Yuuki Iijima, Tokyo, JP;
Kanta Dei, Tokyo, JP;
Assignee:
SENJU METAL INDUSTRY CO., LTD., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
C22C 13/00 (2006.01); B23K 35/26 (2006.01);
U.S. Cl.
CPC ...
B23K 35/262 (2013.01); C22C 13/00 (2013.01);
Abstract
A solder alloy has an alloy composition consisting of, in mass %, Cu: 0.1% to 2.0%, Ni: 0.01% to 0.4%, P: 0.001% to 0.08%, and Ge: 0.001% to 0.08%, with the balance being Sn. The alloy composition satisfies the following relations (1) to (3): (Cu+5Ni)≤0.945% (relation (1)), (P+Ge)≤0.15% (relation (2)), 2.0≤(Cu+5Ni)/(P+Ge)≤1000 (relation (3)). In the above relations (1) to (3), Cu, Ni, P, and Ge each represents a content (mass %) thereof in the solder alloy.