The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2023
Filed:
Dec. 30, 2020
Applicant:
Shennan Circuits Co., Ltd., Shenzhen, CN;
Inventors:
Assignee:
SHENNAN CIRCUITS CO., LTD., Shenzhen, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 3/30 (2006.01); H05K 3/10 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 3/107 (2013.01); H05K 1/023 (2013.01); H05K 1/0231 (2013.01); H05K 1/0233 (2013.01); H05K 1/0234 (2013.01); H05K 1/185 (2013.01); H05K 3/30 (2013.01); H05K 2201/09036 (2013.01);
Abstract
The present disclosure provides a circuit board and a method for manufacturing the circuit board. The circuit board may include: a base board, an embedded component, and an attached component. The base board may define a groove, the embedded component can be disposed in the groove. The attached component can be attached to at least one surface of the base board and connected to the embedded component.