The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2023
Filed:
Oct. 13, 2020
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/033 (2006.01); H01L 21/762 (2006.01); H01L 21/02 (2006.01); H01L 29/04 (2006.01); H01L 21/67 (2006.01); H01L 29/66 (2006.01); H01L 21/66 (2006.01); H01L 23/58 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 21/02104 (2013.01); H01L 21/02532 (2013.01); H01L 21/02667 (2013.01); H01L 21/02669 (2013.01); H01L 21/02672 (2013.01); H01L 21/0332 (2013.01); H01L 21/0337 (2013.01); H01L 21/67288 (2013.01); H01L 21/76224 (2013.01); H01L 21/76262 (2013.01); H01L 21/76278 (2013.01); H01L 21/76281 (2013.01); H01L 21/76283 (2013.01); H01L 22/12 (2013.01); H01L 23/564 (2013.01); H01L 23/58 (2013.01); H01L 29/04 (2013.01); H01L 29/045 (2013.01); H01L 29/66651 (2013.01);
Abstract
A semiconductor device includes a substrate and a semiconductor layer. The substrate includes a planar portion and a plurality of pillars on a periphery of the planar portion. The pillars are shaped as rectangular columns, and corners of two of the pillars at the same side of the planar portion are aligned in a horizontal direction or a direction perpendicular to the horizontal direction. The semiconductor layer is disposed over the planar portion and between the pillars.