The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 07, 2023

Filed:

May. 13, 2020
Applicant:

Asmpt Singapore Pte. Ltd., Singapore, SG;

Inventors:

Chi Wah Cheng, Hong Kong, HK;

Wan Yin Yau, Hong Kong, HK;

Kwok Pun Law, Hong Kong, HK;

Assignee:

ASMPT SINGAPORE PTE. LTD., Singapore, SG;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/687 (2006.01); H01L 21/683 (2006.01); H01L 21/67 (2006.01); H01L 21/68 (2006.01); B65G 49/06 (2006.01); B29C 45/40 (2006.01);
U.S. Cl.
CPC ...
H01L 21/68742 (2013.01); B65G 49/061 (2013.01); B65G 49/067 (2013.01); H01L 21/67132 (2013.01); H01L 21/67259 (2013.01); H01L 21/681 (2013.01); H01L 21/6835 (2013.01); B29C 45/4005 (2013.01); H01L 2221/68322 (2013.01); H01L 2221/68381 (2013.01);
Abstract

A die ejection apparatus operable to eject a die from a support has at least two ejector components configured to lift a die located on the support. The ejector components are moveable to a position in which a lifting force is exertable by the ejector components on the support, so as to lift a die located on the support. Movement of the die ejector components is initiated towards the support, and a moment when each of the die ejector components reaches the position is determined. A height offset of each die ejector component relative to a height of another die ejector component is determined upon reaching the said position, and relative heights of the die ejector components are adjusted in dependence upon the evaluated height offset.


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