The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 07, 2023

Filed:

Dec. 15, 2020
Applicant:

Sang-yun Lee, Hillsboro, OR (US);

Inventor:

Sang-Yun Lee, Hillsboro, OR (US);

Assignee:

BESANG, INC., Hillsboro, OR (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 7/10 (2006.01); G11C 7/06 (2006.01); H01L 27/092 (2006.01); H01L 29/786 (2006.01); H01L 23/528 (2006.01); G11C 7/12 (2006.01); G11C 8/10 (2006.01);
U.S. Cl.
CPC ...
G11C 7/065 (2013.01); G11C 7/12 (2013.01); G11C 8/10 (2013.01); H01L 23/528 (2013.01); H01L 27/092 (2013.01); H01L 29/78618 (2013.01); H01L 29/78642 (2013.01); G11C 2207/12 (2013.01);
Abstract

Structures for 3D sense amplifiers for 3D memories are disclosed. A first embodiment uses one type of vertical transistors in constructing 3D sense amplifiers. A second embodiment uses both n- and p-type transistors for 3D sense amplifiers. Either or both of n- and p-type transistors are vertical transistors. The n- and p-type transistors may reside on different levels, or on the same level above a substrate if both are vertical transistors. In any embodiment, different options are available for gate contact formation. In any embodiments and options or alternatives thereof, one or more sense-enable circuits may be used. Sense amplifiers for several bit lines may be staggered on one or both sides of a memory array. Column multiplexers may be used to couple particular bit lines to data outputs. Bit-line multiplexers may be used to couple certain bit lines to shared 3D sense amplifiers.


Find Patent Forward Citations

Loading…