The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2023
Filed:
Jul. 02, 2019
Applicant:
Lintec Corporation, Tokyo, JP;
Inventors:
Akinori Sato, Saitama, JP;
Masanori Yamagishi, Phoenix, AZ (US);
Assignee:
LINTEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 23/12 (2006.01); C09J 7/38 (2018.01); B32B 27/08 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); B32B 27/36 (2006.01); B32B 27/38 (2006.01); C08L 33/08 (2006.01); C08L 63/00 (2006.01); H01L 21/78 (2006.01); H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3171 (2013.01); B32B 27/08 (2013.01); B32B 27/308 (2013.01); B32B 27/32 (2013.01); B32B 27/36 (2013.01); B32B 27/38 (2013.01); C08L 33/08 (2013.01); C08L 63/00 (2013.01); C09J 7/385 (2018.01); H01L 21/56 (2013.01); H01L 21/561 (2013.01); H01L 21/78 (2013.01); H01L 23/00 (2013.01); H01L 23/12 (2013.01); H01L 23/293 (2013.01); H01L 24/12 (2013.01); H01L 24/94 (2013.01); B32B 2307/54 (2013.01); B32B 2457/14 (2013.01); C08L 2205/025 (2013.01); C08L 2205/035 (2013.01); H01L 2224/12105 (2013.01);
Abstract
This curable resin film forms a first protective film on a surface having bumps of a semiconductor wafer by being attached to the surface and being cured, in which a cured material of the curable resin film has a Young's modulus of equal to or greater than 0.02 MPa and a peak value of a load measured by a probe tack test at 80° C. is equal to or less than 500 g. A first protective film forming sheet is provided with a first supporting sheet, and the curable resin film is provided on one surface of the first supporting sheet.