The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 21, 2023

Filed:

Dec. 22, 2020
Applicants:

Nichia Corporation, Anan, JP;

Shinko Electric Industries Co., Ltd., Nagano, JP;

Inventors:

Hidenori Matsuo, Hadano, JP;

Masaki Omori, Toshima-ku, JP;

Wataru Katayama, Nagano, JP;

Ryota Mitsui, Kita-ku, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/02216 (2021.01); H01S 5/024 (2006.01); H01S 5/0237 (2021.01);
U.S. Cl.
CPC ...
H01S 5/02216 (2013.01); H01S 5/0237 (2021.01); H01S 5/02469 (2013.01);
Abstract

A package for at least one laser diode includes: leads configured to be electrically connected to the at least one laser diode; a base including a mounting surface on which the at least one laser diode is to be mounted and a lateral wall located around the mounting surface so as to surround the at least one laser diode, the lateral wall defining first through-holes and including a light-transmissive part configured to transmit a laser beam emitted from the at least one laser diode; and a lead holding member bonded to the lateral wall of the base and defining second through-holes. The leads are disposed through the first through-holes and the second through-holes. At least a central portion of each of the leads is made of copper.


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