The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 21, 2023

Filed:

May. 15, 2019
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Seokcheon Baek, Hwaseong-si, KR;

Geunwon Lim, Yongin-si, KR;

Jaehoon Shin, Suwon-si, KR;

Myungkeun Lee, Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/11556 (2017.01); H01L 29/792 (2006.01); H01L 27/11582 (2017.01);
U.S. Cl.
CPC ...
H01L 27/11556 (2013.01); H01L 27/11582 (2013.01); H01L 29/7926 (2013.01);
Abstract

Disclosed is a three-dimensional semiconductor memory device comprising a peripheral circuit structure on a first substrate, a second substrate on the peripheral circuit structure, first to fourth stack structures spaced apart in a first direction on the second substrate, first and second support connectors between the second and third stack structures, third and fourth support connectors between the third and fourth stack structures, and a through dielectric pattern penetrating the first stack structure and the second substrate. A first distance between the first and second support connectors is different from a second distance between the third and fourth support connectors.


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