The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 21, 2023

Filed:

Mar. 18, 2021
Applicant:

Nxp Usa, Inc., Austin, TX (US);

Inventors:

Vikas Shilimkar, Chandler, AZ (US);

Ramanujam Srinidhi Embar, Gilbert, AZ (US);

Assignee:

NXP USA, Inc., Austin, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/485 (2006.01); H01L 23/552 (2006.01); H01L 23/00 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 23/485 (2013.01); H01L 23/552 (2013.01); H01L 24/81 (2013.01); H01L 29/0696 (2013.01);
Abstract

An amplifier module includes a module substrate and first and second power transistor dies. The first power transistor die is coupled to a mounting surface of the module substrate, and has first and second input/output (I/O) contact pads and a first ground contact pad, all of which are all exposed at a surface of the first power transistor die that faces toward the mounting surface of the module substrate. The second power transistor die also is coupled to the mounting surface, and has third and fourth I/O contact pads and a second ground contact pad. The third and fourth I/O contact pads are exposed at a surface of the second power transistor die that faces away from the mounting surface of the module substrate, and the second ground contact pad is exposed at a surface of the second power transistor die that faces toward the mounting surface.


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