The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 2023
Filed:
Mar. 08, 2019
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Inventors:
Yung-Chang Huang, Taichung, TW;
Yu-Chi Tsai, Hsinchu, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); B25J 9/16 (2006.01); H01L 21/324 (2006.01); B25J 11/00 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67259 (2013.01); B25J 9/1674 (2013.01); B25J 11/0095 (2013.01); H01L 21/324 (2013.01); H01L 21/67103 (2013.01); H01L 21/68707 (2013.01); G05B 2219/45031 (2013.01);
Abstract
An annealing apparatus includes a heater plate and a cooler plate disposed in a chamber, a delivering robot, a sensor and circuitry. The delivering robot is configured to deliver a wafer between the heater plate and the cooler plate in the chamber. The sensor is located on the delivering robot and configured to output a first signal in response to a motion of the delivering robot. The circuitry is coupled to the sensor and configured to detect whether an abnormality of the delivering robot occurs according to the first signal.