The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 2023
Filed:
Dec. 23, 2020
Applicant:
Tokyo Electron Limited, Tokyo, JP;
Inventors:
Yoshihiro Takezawa, Nirasaki, JP;
Daisuke Suzuki, Nirasaki, JP;
Hiroyuki Hayashi, Nirasaki, JP;
Yutaka Motoyama, Nirasaki, JP;
Assignee:
TOKYO ELECTRON LIMITED, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/3065 (2006.01); H01L 21/306 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02595 (2013.01); H01L 21/0245 (2013.01); H01L 21/02505 (2013.01); H01L 21/02513 (2013.01); H01L 21/02532 (2013.01); H01L 21/02592 (2013.01); H01L 21/02669 (2013.01); H01L 21/02672 (2013.01); H01L 21/0262 (2013.01); H01L 21/02381 (2013.01); H01L 21/02488 (2013.01); H01L 21/3065 (2013.01); H01L 21/30604 (2013.01);
Abstract
A film forming method includes: forming a laminated film, in which an interface layer, a bulk layer, and a surface layer are laminated in this order, on a base; and crystallizing the laminated film, wherein the bulk layer is formed of a film that is easier to crystallize than the interface layer in crystallizing the laminated film, and wherein the surface layer is formed of a film that is easier to crystallize than the bulk layer in crystallizing the laminated film.