The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 2023
Filed:
Jun. 16, 2021
Micron Technology, Inc., Boise, ID (US);
Taeksang Song, San Jose, CA (US);
Hyunyoo Lee, Boise, ID (US);
Saira Samar Malik, Lafayette, IN (US);
Kang-Yong Kim, Boise, ID (US);
Micron Technology, Inc., Boise, ID (US);
Abstract
Methods, systems, and devices for direct testing of in-package memory are described. A memory subsystem package may include non-volatile memory, volatile memory that may be configured as a cache, and a controller. The memory subsystem may support direct access to the non-volatile memory for testing the non-volatile memory in the package using a host interface of the memory subsystem rather than using dedicated contacts on the package. To ensure deterministic behavior during testing operations, the memory subsystem may, when operating with a test mode enabled, forward commands received from a host device (such as automated test equipment) to a memory interface of the non-volatile memory and bypass the cache-related circuitry. The memory subsystem may include a separate conductive path that bypasses the cache for forwarding commands and addresses to the memory interface during testing.