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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11584019 B1

PDFFull Text
Date of Patent:
Feb. 21, 2023

Filed:

Dec. 07, 2020

Substrate carrier deterioration detection and repair

Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Jen-Ti Wang, Taichung, TW;

Chih-Wei Lin, Hsinchu, TW;

Fu-Hsien Li, Taichung, TW;

Yi-Ming Chen, Taipei County, TW;

Cheng-Ho Hung, Tainan, TW;

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;

Attorney:

Haynes and Boone, LLP

Primary Examiner:

James Keenan

Int. Cl.
CPC ...
B25J 11/00 (2006.01); G01B 11/30 (2006.01); H01L 21/67 (2006.01); H01L 21/02 (2006.01); H01L 21/66 (2006.01); B25J 18/00 (2006.01); G01B 11/24 (2006.01); G01N 33/00 (2006.01); H01L 21/673 (2006.01); H01L 21/677 (2006.01); B23P 6/00 (2006.01); B25J 1/04 (2006.01);
U.S. Cl.
CPC ...
B25J 11/008 (2013.01); G01B 11/306 (2013.01); H01L 21/67005 (2013.01); B23P 6/00 (2013.01); B25J 1/04 (2013.01); B25J 11/005 (2013.01); B25J 18/00 (2013.01); G01B 11/24 (2013.01); G01N 33/0004 (2013.01); G01N 33/0013 (2013.01); G01N 33/0024 (2013.01); G01N 33/0029 (2013.01); G01N 33/0031 (2013.01); G01N 33/0062 (2013.01); G01N 33/0063 (2013.01); G01N 33/0065 (2013.01); G01N 2033/0095 (2013.01); H01L 21/0201 (2013.01); H01L 21/02043 (2013.01); H01L 21/02049 (2013.01); H01L 21/673 (2013.01); H01L 21/6779 (2013.01); H01L 21/67389 (2013.01); H01L 21/67393 (2013.01); H01L 21/67733 (2013.01); H01L 21/67736 (2013.01); H01L 21/67742 (2013.01); H01L 21/67775 (2013.01); H01L 21/67778 (2013.01); H01L 22/30 (2013.01); Y10T 29/49769 (2015.01); Y10T 29/49771 (2015.01);
Abstract

An apparatus for semiconductor manufacturing includes an input port to receive a carrier, wherein the carrier includes a carrier body, a housing installed onto the carrier body, and a filter installed between the carrier body and the housing. The apparatus further includes a first robotic arm to uninstall the housing from the carrier and to reinstall the housing into the carrier; one or more second robotic arms to remove the filter from the carrier and to install a new filter into the carrier; and an output port to release the carrier to production.

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