The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 21, 2023

Filed:

May. 12, 2020
Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Hiroyuki Shinozaki, Tokyo, JP;

Yuta Suzuki, Tokyo, JP;

Taro Takahashi, Tokyo, JP;

Seiji Katsuoka, Tokyo, JP;

Masahiro Hatakeyama, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/013 (2012.01); B24B 37/10 (2012.01); B24B 49/10 (2006.01); B24B 49/16 (2006.01); B24B 37/04 (2012.01); B24B 37/32 (2012.01);
U.S. Cl.
CPC ...
B24B 37/013 (2013.01); B24B 37/042 (2013.01); B24B 37/10 (2013.01); B24B 37/32 (2013.01); B24B 49/10 (2013.01); B24B 49/16 (2013.01);
Abstract

In a scheme in which a top ring is held to an end portion of a swing arm, the present invention improves accuracy of polishing end point detection. A polishing apparatus for polishing between a polishing padand a semiconductor waferdisposed opposed to the polishing padincludes a polishing tableA for holding the polishing padand a top ringA for holding the semiconductor wafer. A swing shaft motorswings a swing armfor holding the top ringA. The arm torque detection sectiondetects arm torque applied to the swing arm. An end point detection sectiondetects a polishing end point indicating an end of polishing based on the detected arm torque.


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